MASKING JIG, SUBSTRATE HEATING APPARATUS, AND FILM FORMATION METHOD

摘要

A cooler (30) is connected to a back surface (10b) of an insulating substrate (10). A masking jig (60) is used to specify a coating region in which a coating (41a) is to be formed by spraying copper powder (41) onto a front surface (10a) of the insulating substrate (10) from a cold spray device (40). This masking jig (60) includes a metal member (61) formed with an opening (63) for specifying the coating region and placed in contact with the front surface (10a) of the insulating substrate (10). The metal member (61) internally includes a heating wire (70) is provided to heat the vicinity of the opening (63). Accordingly, in the case where the cooler (30) is connected in advance to the back surface (10b) of the substrate (10) constituting a power module, the front surface (10a) of the substrate (10) having been heated by a low-cost structure, the cold spray device (40) is allowed to spray the copper powder (41) onto the front surface (10a) of the substrate (10).