| 摘要 |
The present invention provides a method for manufacturing a composite piezoelectric substrate capable of forming an ultrathin piezoelectric film having a uniform thickness by efficiently using a piezoelectric material. a) A piezoelectric substrate (2) and a supporting substrate (10) are prepared, b) ions are implanted from a surface (2a) of the piezoelectric substrate (2) to form a defective layer (4) in a region having a predetermined depth from the surface (2a) of the piezoelectric substrate (2), c) impurities adhering to at least one of the surface (2a) of the piezoelectric substrate (2) in which the defective layer (4) is formed and a surface (10a) of the supporting substrate (1) are removed to directly expose the constituent atoms of the surfaces (2a and 10a) and activate them, d) the supporting substrate (10) is bonded to the surface (2a) of the piezoelectric substrate (2) to form a substrate bonded body (40), e) the substrate bonded body (40) is separated at the defective layer (4) formed in the piezoelectric substrate (2) so that a separation layer (3) between the surface (2a) of the piezoelectric substrate (2) and the defective layer (4) is separated from the piezoelectric substrate (2) and bonded to the supporting substrate (10) to form a composite piezoelectric substrate (30), and f) the surface (3a) of the separation layer (3) of the composite piezoelectric substrate (30) is smoothed. |
