| 摘要 |
<p>#CMT# #/CMT# The method involves incorporating contiguous perforated patterns (5) with a closed peripheral sealing strip (3) before crushing the strip, where the patterns delimit void zones i.e. holes (6), within the strip and are formed by bars. The strip is made of photoresist, and is crushed for bonding two facing substrates e.g. silicon substrate, with respect to each other, where the strip delimits a closed cavity between the substrates. Ratio of a surface of the void zones of the strip to an entire surface of the strip is in the range of 10 to 50 percentages in a plane parallel to the substrates. #CMT# : #/CMT# An independent claim is also included for a structure comprising a closed peripheral sealing strip with contiguous perforated patterns. #CMT#USE : #/CMT# Method for producing a structure (claimed) e.g. microelectronic chip, of a micro electronic system such as micro-electro mechanical system or micro-opt-electro mechanical system. #CMT#ADVANTAGE : #/CMT# The method enables producing the structure with better control of deformation of the sealing strip, and is easy to implement, thus achieving better control of the cavity size with respect to the sealing strip. The contiguous perforated patterns delimit the void zones within the sealing strip so as to improve the propensity of the sealing strip to crush compared with an uninterrupted solid strip, thus improving a contact surface of the sealing strip, and hence improving the adherence between the sealing strip and the two substrates. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic top view of a portion of a closed peripheral sealing strip used in a structure producing method. D : Diameter L : Width 3 : Closed peripheral sealing strip 5 : Contiguous perforated pattern 6 : Hole.</p> |
