Devices for leveling an object for patterning a substrate surface, including an array of scanning probe tips, are provided. A device may include a support structure adapted to mount an object, the object having a plurality of protrusions adapted to form a pattern on a surface of a substrate upon contact of the object to the surface; and at least one flexible joint assembly mounted to the support structure and adapted to allow the object to achieve a parallel orientation with respect to the surface upon contact of the object to the surface. Also provided are apparatuses and kits incorporating the devices and methods of making and using the devices and apparatuses.