SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

摘要

PURPOSE: A semiconductor package and a semiconductor device packaging method are provided to reduce mechanical stress due to a difference of thermal coefficients of a die and a mold compound within the package by providing a step between a cap surface and an active surface of the die. CONSTITUTION: A substrate comprises a first major surface(111) and a second major surface(112). The first major surface comprises a first region(111a) and a second region(111b). A die(150) is installed on the first region. The die comprises a first surface(150a) and a second major surface(150b). A conductive trace(140) is arranged on a second surface of a first insulation substrate layer(113). The conductive trace comprises a conductive pad(168).