| 摘要 |
PURPOSE: A microelectronic package which includes a terminal on a dielectric member is provided to be easily applied to a stacked structure by providing upper terminals connected to conductive elements on a package substrate. CONSTITUTION: A metal sheet(30) comprises a first surface(32) and a second surface. A plurality of conductive traces(36) is located on the first surface. The trace is formed with a terminal(38) which has similar composition into one body. The terminal is arranged on a first part(40) of the metal sheet. A second part(42) includes both end parts of the first part. |
