| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package substrate with high reliability that can effectively perform bumping and remove resist on forming a metal post by bumping, without damaging to the metal post while achieving an economical and efficient process.SOLUTION: The method comprises a step of preparing a base substrate 101 having a connection pad 102 exposed by a solder resist open part; a step of forming a foam resin layer 107 having an opening for forming a metal post on a solder resist 103; a step of forming a metal post 108 on the opening; and a step of removing the foam resin layer 107. |
