发明名称 Carrier tape for TAB-package and Manufacturing method thereof
摘要 The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.
申请公布号 KR101148099(B1) 申请公布日期 2012.05.23
申请号 KR20100096018 申请日期 2010.10.01
申请人 发明人
分类号 H01L23/48;H01L21/60 主分类号 H01L23/48
代理机构 代理人
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