发明名称 INTEGRATED CIRCUIT PACKAGE
摘要 <p>An integrated circuit combination, comprising first and second integrated circuit dies with respective first and second control register banks, and a path for external control data, within said combination, coupling a first data interface on said first die, which receives the external control data, to the first and second control register banks.</p>
申请公布号 KR20120052338(A) 申请公布日期 2012.05.23
申请号 KR20127004500 申请日期 2010.07.21
申请人 WOLFSON MICROELECTRONICS PLC 发明人 MORE GRANT M.;HAIPLIK HOLGER;KERJIWAL ABHAY
分类号 G06F13/362 主分类号 G06F13/362
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