PURPOSE: A method for manufacturing a multilayer board is provided to reduce temperature deflection according to location of a plurality of laminated substrates by laminating Cu foil in order to protect a printed circuit board and/or a cushion pad. CONSTITUTION: Cushion pads(120) are located between a top heating source(110a) and a bottom heating source(110b). A plurality of printed circuit boards(130) is laminated between the cushion pads. Cu foil(140) is laminated in order to protect the plurality of printed circuit boards. An SUS plate(150) is laminated between the printed circuit boards protected by the Cu foil. The SUS plate is laminated between the cushion pad and the printed circuit board. The top heating source and the bottom heating source are pressurized. Heat of the top heating source and the bottom heating source is uniformly transferred to the plurality of printed circuit boards by the Cu foil.
