发明名称 |
LED flip-chip package structure with dummy bumps |
摘要 |
A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip. |
申请公布号 |
US8183579(B2) |
申请公布日期 |
2012.05.22 |
申请号 |
US20100715838 |
申请日期 |
2010.03.02 |
申请人 |
WANG CHUNG YU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG CHUNG YU |
分类号 |
H01L27/15;H01L31/12;H01L33/00 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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