发明名称 |
Light emitting element, method for manufacturing light emitting element, light emitting element assembly, and method for manufacturing light emitting element assembly |
摘要 |
A method for manufacturing a light emitting element includes the steps of (A) forming sequentially a first compound semiconductor layer having a first conduction type, an active layer, and a second compound semiconductor layer having a second conduction type on a substrate, (B) forming a plurality of point-like hole portions in a thickness direction in at least a region of the second compound semiconductor layer located outside a region to be provided with a current confinement region, and (C) forming an insulating region by subjecting a part of the second compound semiconductor layer to an insulation treatment from side walls of the hole portions so as to produce the current confinement region surrounded by the insulating region in the second compound semiconductor layer.
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申请公布号 |
US8183074(B2) |
申请公布日期 |
2012.05.22 |
申请号 |
US20080013748 |
申请日期 |
2008.01.14 |
申请人 |
MASUI YUJI;ARAKIDA TAKAHIRO;KODA RINTARO;OKI TOMOYUKI;SONY CORPORATION |
发明人 |
MASUI YUJI;ARAKIDA TAKAHIRO;KODA RINTARO;OKI TOMOYUKI |
分类号 |
H01L21/479;H01S5/183 |
主分类号 |
H01L21/479 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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