| 摘要 |
The invention relates to a polyamide molding compound consisting of the following constituents: (A) between 25 and 70 wt. % of an aliphatic polyamide selected from the group PA1010, PA1012, PA1014, PA1210, PA1212, PA1214, PA12 and PA11, or a mixture of at least two of said systems; (B) between 8 and 35 wt. % of a transparent polyamide selected from the group MACM9-36, MACM9-36/PACM9-36, MACMI/12, MACMI/MACMT/12, or a mixture of at least two of said systems; (C) between 10 and 60 wt. % of reinforcing materials; (D) between 0 and 30 wt. % of particulate and/or layered filling materials; and (E) between 0 and 5 wt. % of auxiliary materials and/or additives, the sum of the constituents (A)-(E) amounting to 100 wt. %. Fibers are used at least partially as reinforcing materials (C), the cross-sectional surface of the fibers being either circular or the dimensional ratio of the main cross-sectional axis to the secondary cross-sectional axis being below 2. The invention also relates to uses of such a polyamide molding compound and components at least partially produced using such a polyamide molding compound. |
