发明名称 |
Semiconductor device having an interposer |
摘要 |
A semiconductor device and a method of fabricating the same. An interposer used for the semiconductor device includes integrated circuits therein to realize the functions of a decoupling capacitor, an ESD preventing circuit, an impedance matching circuit, and termination. The semiconductor device may include a semiconductor die with a through silicon via (TSV) structure having two or more through electrodes that pass through the semiconductor die, in which each of the through electrodes are connected to a respective bond pad of the semiconductor die.
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申请公布号 |
US8183678(B2) |
申请公布日期 |
2012.05.22 |
申请号 |
US20090535316 |
申请日期 |
2009.08.04 |
申请人 |
LEE CHOON HEUNG;BAE KI CHEOL;NA DO HYUN;AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
LEE CHOON HEUNG;BAE KI CHEOL;NA DO HYUN |
分类号 |
H01L25/065;H01L21/50;H01L23/52 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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