发明名称 LED-PACKAGE USING PLURAL LED CHIP
摘要 <p>PURPOSE: An LED package which uses a plurality of LED chips is provided to alternatively arrange LEDs into two rows, thereby uniformly forming overall brightness distribution. CONSTITUTION: A plurality of LED chips(30) is mounted on a substrate part(17). A frame(13) fixes the substrate part. A bonding wire(33) electrically connects the plurality of LED chips. An anode(20) and a cathode(21) are respectively arranged on both sides of the substrate part. A p-side electrode(31) of the LED chip is electrically connected to the anode. An n-side electrode(32) of the LED chip is electrically connected to the cathode.</p>
申请公布号 KR20120051369(A) 申请公布日期 2012.05.22
申请号 KR20100112774 申请日期 2010.11.12
申请人 LEDST CO., LTD.;AN, JONG UK 发明人 AN, JONG UK
分类号 H01L33/48 主分类号 H01L33/48
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