发明名称 |
LED-PACKAGE USING PLURAL LED CHIP |
摘要 |
<p>PURPOSE: An LED package which uses a plurality of LED chips is provided to alternatively arrange LEDs into two rows, thereby uniformly forming overall brightness distribution. CONSTITUTION: A plurality of LED chips(30) is mounted on a substrate part(17). A frame(13) fixes the substrate part. A bonding wire(33) electrically connects the plurality of LED chips. An anode(20) and a cathode(21) are respectively arranged on both sides of the substrate part. A p-side electrode(31) of the LED chip is electrically connected to the anode. An n-side electrode(32) of the LED chip is electrically connected to the cathode.</p> |
申请公布号 |
KR20120051369(A) |
申请公布日期 |
2012.05.22 |
申请号 |
KR20100112774 |
申请日期 |
2010.11.12 |
申请人 |
LEDST CO., LTD.;AN, JONG UK |
发明人 |
AN, JONG UK |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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