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发明名称
雷射加工装置及雷射加工控制装置
摘要
本发明的目的在于获得一种能够使被加工物加工精密度佳且迅速地进行加工的雷射加工装置。;本发明的雷射加工装置系藉由电镜扫描器将雷射光导向被加工物上的照射位置,且射出脉波型的雷射光至成为加工孔的雷射光的照射位置而进行爆射式加工者,其中,具备有:控制部11,以同步于雷射光的照射位置到达至目标照射位置后的电镜扫描器6A、6B的残留振动频率而射出脉波型的雷射光之方式控制以雷射振荡器1所照射的雷射光的照射时序。
申请公布号
TWI364338
申请公布日期
2012.05.21
申请号
TW097148881
申请日期
2008.12.16
申请人
三菱电机股份有限公司 日本
发明人
成濑正史;鉾馆俊之;川野繁朗;高桥悌史
分类号
B23K26/06;B23K26/073
主分类号
B23K26/06
代理机构
代理人
洪武雄 台北市中正区博爱路35号9楼;陈昭诚 台北市中正区博爱路35号9楼
主权项
地址
日本
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