| 摘要 |
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve the transfer characteristic of an electric signal by connecting a semiconductor chip to a PCB by using a connection metal layer. CONSTITUTION: A semiconductor chip(300) comprises a connection bump(350) projected in one side. A printed circuit board(100) comprises an outer connector(150) formed in the outermost circuit layer. A connection metal layer(500) connects the connection bump to the outer connector. The connection metal layer is a plating layer. The end part of the connection bump is contacted with the outer connector. |
