PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to minutely form a circuit pattern by forming a via with a landless structure. CONSTITUTION: A via hole(112) passes through an insulation layer(110). A seed(122) is formed on the upper side and the lower side of the insulation layer. A circuit pattern(130) is formed on the seed. A first via(140) is formed in the via hole. A build-up layer(150) is formed on the insulation layer to cover the circuit pattern and the first via. A second via(160) is electrically connected to the first via in the build-up layer.