SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package substrate and a manufacturing method thereof are provided to improve adhesive force between a solder resist layer and a sealing member by forming a rough layer on the surface of the solder resist layer by spraying a liquid resin. CONSTITUTION: A solder resist layer(120) is formed on one or both surfaces of a package substrate(110). The solder resist layer includes an opening part(125) for exposing a connection pad(111). The solder resist layer includes a semiconductor mounting region(A) and an exposure region(B) exposed to the outside. A rough layer(130) is formed on the solder resist layer. The rough layer is comprised of a liquid resin sprayed through an ink jet.