| 摘要 |
A semiconductor chip supply method of a bonder is provided to prevent the generation of a vision align error by aligning and picking up semiconductor chips after compensating align positions of the semiconductor chips for the rotation of a wafer stage. A magazine loaded with a wafer frame is stably loaded on a wafer loader(S200). A teaching process is performed on align points of the wafer frame and align positions of each semiconductor chip of a wafer, wherein the wafer is fixed on the wafer frame(S300). The wafer frame is loaded to a wafer stage from the wafer loader(S400). An align value of the wafer frame is calculated from the align points and the wafer stage is rotated according to the calculated align value(S500). The align position of each semiconductor chip is compensated by reflecting a rotation value of the wafer stage(S600). Each semiconductor chip is aligned with compensated align position(S700). The aligned semiconductor chip is picked up(S800).
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