| 摘要 |
PURPOSE: A multiple copper clad laminate, a manufacturing method thereof, and a method for manufacturing a printed circuit board using the same are provided to improve productivity by shorting a manufacturing time. CONSTITUTION: A double copper clad film(100) includes a first copper clad film(110), a second copper clad film(120), and a release layer. A third copper clad film(200) is arranged on the upper side of the double copper clad film. A fourth copper clad film(300) is arranged on the lower side of the double copper clad film. A plurality of insulation films(400) is arranged among the double copper clad film, the third copper clad film, and the fourth copper clad film. An insulation film includes a glass fiber and a resin impregnated in the glass fiber.
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