ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ASSEMBLY
摘要
The invention relates to the use of an adhesive compound for encapsulating an (opto-)electronic application, containing an organometallically modified polymer created by reacting an elastomer with an organometallic compound, wherein the central atom of the organometallic compound is a metal or metalloid of the 3rd and 4th main groups or 3rd and 4th subgroups.
申请公布号
WO2012062587(A1)
申请公布日期
2012.05.18
申请号
WO2011EP68822
申请日期
2011.10.27
申请人
TESA SE;STEEN, ALEXANDER;KRAWINKEL, THORSTEN;KEITE-TELGENBUESCHER, KLAUS;GRUENAUER, JUDITH;ELLINGER, JAN
发明人
STEEN, ALEXANDER;KRAWINKEL, THORSTEN;KEITE-TELGENBUESCHER, KLAUS;GRUENAUER, JUDITH;ELLINGER, JAN