发明名称 |
BUBBLE-CONTAINING THERMALLY-CONDUCTIVE RESIN-COMPOSITION LAYER, MANUFACTURING METHOD THEREFOR, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING SAID RESIN-COMPOSITION LAYER |
摘要 |
<p>A bubble-containing thermally-conductive resin-composition layer containing at least the following: (a) an acrylic polymer, the principal monomer component of which is an alkyl (meth)acrylate ester; (b) thermally conductive particles; and (c) bubbles.</p> |
申请公布号 |
WO2012063935(A1) |
申请公布日期 |
2012.05.18 |
申请号 |
WO2011JP76048 |
申请日期 |
2011.11.11 |
申请人 |
NITTO DENKO CORPORATION;TERADA, YOSHIO;TOJO, MIDORI;NAKAYAMA, YUSUKE |
发明人 |
TERADA, YOSHIO;TOJO, MIDORI;NAKAYAMA, YUSUKE |
分类号 |
C08J9/12;C08K3/00;C08L33/06;C09J7/02;C09J11/04;C09J133/04 |
主分类号 |
C08J9/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|