发明名称 BUBBLE-CONTAINING THERMALLY-CONDUCTIVE RESIN-COMPOSITION LAYER, MANUFACTURING METHOD THEREFOR, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING SAID RESIN-COMPOSITION LAYER
摘要 <p>A bubble-containing thermally-conductive resin-composition layer containing at least the following: (a) an acrylic polymer, the principal monomer component of which is an alkyl (meth)acrylate ester; (b) thermally conductive particles; and (c) bubbles.</p>
申请公布号 WO2012063935(A1) 申请公布日期 2012.05.18
申请号 WO2011JP76048 申请日期 2011.11.11
申请人 NITTO DENKO CORPORATION;TERADA, YOSHIO;TOJO, MIDORI;NAKAYAMA, YUSUKE 发明人 TERADA, YOSHIO;TOJO, MIDORI;NAKAYAMA, YUSUKE
分类号 C08J9/12;C08K3/00;C08L33/06;C09J7/02;C09J11/04;C09J133/04 主分类号 C08J9/12
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