THERMOSETTING SILICONE RESIN COMPOSITION, AND SILICONE RESIN-CONTAINING STRUCTURE AND OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULANT OBTAINED USING SAME

摘要

The purpose of the present invention is to provide a thermosetting silicone resin composition containing a tin compound and having excellent thermosetting properties and stability at room temperature. This thermosetting silicone resin composition contains an organopolysiloxane (A) having a silanol group, a silane compound (B) having an alkoxysilyl group, a tin compound (C), and a zinc compound (D). The tin compound (C) content is 0.001-1 parts by mass relative to 100 parts by mass of the total of the organopolysiloxane (A) and the silane compound (B). The zinc compound (D) content is 0.01-5 parts by mass relative to 100 parts by mass of the total of the organopolysiloxane (A) and the silane compound (B). The mass ratio (C/D) value of the tin compound (C) relative to the zinc compound (D) is less than 1.