SUBSTRATE INSPECTION METHOD, SUBSTRATE INSPECTION DEVICE, EXPOSURE SYSTEM, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

[Problem] To provide an inspection method for silicon substrates (wafers) that enables the inspection of the inner part of patterns. [Solution] A substrate inspection method has: an irradiation step (S101) in which one or other surface of a silicon substrate having a predetermined pattern formed on one surface thereof is irradiated with an illuminating light capable of permeating the silicon substrate; a detection step (S102) in which light is detected from the silicon substrate on which the illuminating light is irradiated; and an inspection step (S103) in which the silicon substrate is inspected using the characteristics of the light using the pattern periodicity from the detection signal of the light detected from the silicon substrate in the detection step.