发明名称 |
PRODUCTION METHOD FOR SOLDER TRANSFER BASE MATERIAL, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER BASE MATERIAL |
摘要 |
<p>Provided is a production method for a solder transfer base material which makes forming a solder layer with a thickness that is appropriate for the electronic part or circuit board. The production method is provided with: an adhesive layer forming process, in which an adhesive layer (2) is formed on the surface of a base material; a solder layer forming process, in which a solder layer is formed by positioning a plurality of solder powder bodies (3) in such a way that openings are formed between the solder powder bodies; and a filler supplying process in which fillers (4) are supplied between the solder powder into the openings formed on the adhesive layer.</p> |
申请公布号 |
WO2012063386(A1) |
申请公布日期 |
2012.05.18 |
申请号 |
WO2011JP04731 |
申请日期 |
2011.08.25 |
申请人 |
PANASONIC CORPORATION;SAKURAI, DAISUKE |
发明人 |
SAKURAI, DAISUKE |
分类号 |
B23K1/20;B23K1/00;B23K3/06;B23K101/40;H01L21/60;H05K3/24;H05K3/34 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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