| 摘要 |
PURPOSE: A manufacturing method of a semiconductor device is provided to provide a semiconductor device with excellent high temperature and high-humidity reliability without degradation of moldability and hardening property. CONSTITUTION: A manufacturing method of a semiconductor device comprises a step of resin-sealing a semiconductor device by using epoxy resin composition for sealing semiconductor, and a step of heat-treating. The epoxy resin composition comprises an epoxy resin in chemical formula 1, a phenol resin, an amine-based hardening accelerator, and an inorganic filler. In chemical formula 1, X is a single bond, -CH2-, -S- or -O-, and R1-R4 is -H or -CH3, and is acceptable to be same or different from each other.
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