METHOD FOR ALLOCATING SEMICONDUCTOR PACKAGE TERMINALS, DEVICE FOR ASSISTING ALLOCATION OF SEMICONDUCTOR PACKAGE TERMINALS, SEMICONDUCTOR PACKAGE, AND PROGRAM THAT EXECUTES METHOD FOR ALLOCATING SEMICONDUCTOR PACKAGE TERMINALS

摘要

The present invention efficiently performs allocation processing of one of a plurality of terminals of a package substrate equipped with a semiconductor chip to each of a plurality of pads of the semiconductor chip. When allocating one of the plurality of terminals of the package substrate to each of the plurality of pads of the semiconductor chip, the longest allowable distance between each pad and the terminal to be allocated to the pad is prescribed as a constraint, and one or a plurality of allocation terminal candidates is extracted for each pad in a manner so that the relative distance between each pad and the terminal selected for the pad is within the range of the longest allowable distance. On the basis of the extracted allocation terminal candidates, processing is performed determining one terminal as an allocation terminal and allocating the allocation terminal to one pad. The processing prioritizes the allocation of a terminal to the pad for which the number of unallocated allocation terminal candidates is the smallest and at least one.