INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES
摘要
An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
申请公布号
WO2012064567(A1)
申请公布日期
2012.05.18
申请号
WO2011US58999
申请日期
2011.11.02
申请人
PAKULA, DAVID;APPLE INC.;LYNCH, STEPHEN BRIAN;DINH, RICHARD HUNG MINH;TAN, TANG YEW;TAN, LEE HUA
发明人
PAKULA, DAVID;LYNCH, STEPHEN BRIAN;DINH, RICHARD HUNG MINH;TAN, TANG YEW;TAN, LEE HUA