LASER PROCESSING METHOD AND DEVICE

摘要

A laser processing method is provided with an application step for setting a light focusing part within an object to be processed and applying laser light to form a reformed region due to multiphoton absorption within the object to be processed, and a cutting step for forming a plurality of the reformed regions such that crack regions each formed around the reformed region are continuous from the surface on the reverse side to the laser light incidence surface side of the object to be processed to the surface on the laser light incidence surface side.