PROBE AND PROBE MANUFACTURING METHOD

摘要

PURPOSE: A probe and a probe manufacturing method are provided to reduce a width of a bonding pad by performing junction with fused solder in a probe. CONSTITUTION: A tip portion(101) is touched with a target object. A probe body(110) elastically supports the tip portion. The probe body has a plate shaped bonding portion(113) on a lower portion. A first solder portion is formed by being buried and while being exposed to one side of the bonding portion. The first solder portion is fused to attach the probe body to a circuit board.