发明名称 |
ADHESIVE FILM AND TAPE FOR SEMICONDUCTOR WAFER PROCESSING |
摘要 |
<p>Provided are an adhesive film and a tape for semiconductor wafer processing, which are reduced in softening of a bonding agent layer due to the absorption of moisture in the air and are thus capable of suppressing the occurrence of pick up failure. This adhesive film is composed of a base film and an adhesive layer that is provided on the base film, and has a water vapor permeability of 10.0 g/m2/day or less. This tape for semiconductor wafer processing comprises an adhesive film, which is composed of a base film and an adhesive layer that is provided on the base film, and a bonding agent layer that is formed on the adhesive layer, and the adhesive film has a water vapor permeability of 10.0 g/m2/day or less.</p> |
申请公布号 |
WO2012063343(A1) |
申请公布日期 |
2012.05.18 |
申请号 |
WO2010JP70072 |
申请日期 |
2010.11.11 |
申请人 |
FURUKAWA ELECTRIC CO.,LTD.;AOYAMA, MASAMI;ISHIWATA, SHINICHI;MORISHIMA, YASUMASA |
发明人 |
AOYAMA, MASAMI;ISHIWATA, SHINICHI;MORISHIMA, YASUMASA |
分类号 |
C09J7/02;H01L21/301 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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