| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor package is provided to steadily fill a space between a semiconductor chip and a substrate without the generation of void by filling the space with ball type filler which is liquefied. CONSTITUTION: A plurality of bonding pads(110) and a dummy pad(120) are formed on one side of a semiconductor chip(100). A connection member(130) is attached on the bonding pad of the semiconductor chip. The connection member comprises a bump. A plurality of ball type fillers(140) is attached on the dummy pad of the semiconductor chip. The semiconductor chip is flip-chip-bonded on the upper side of a substrate by the connection member. A space between the flip-chip-bonded semiconductor chip and the substrate is filled with the ball type filler.</p> |
