| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe card that helps solve the problems of defective contact or fracture of contact points due to relative positional deviation accompanying a temperature change, ensures satisfactory checkup of electrical characteristics of all semiconductor chips even in a broad temperature range, and moreover reduces the cost. <P>SOLUTION: A low-cost substrate is realized by collectively fixing a reinforcing board, a metal base and a probe assembling and fixing board, all using a material whose thermal expansion coefficient is close to that of silicon wafers, connecting a probe and a wiring board to each other by only a spring force in the perpendicular direction, and using a configuration having a plurality of values of relative positions of the tips of adjacent probe connecting terminals in the lengthwise direction (X direction) and the perpendicular direction (Z direction) of the probe; furthermore, one or more probes are structured to be detachable. <P>COPYRIGHT: (C)2012,JPO&INPIT |
