发明名称 |
LEAD PIN FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME |
摘要 |
Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.
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申请公布号 |
US2012118620(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US20110987668 |
申请日期 |
2011.01.10 |
申请人 |
BAEK YONG HO;PARK SEOK HYUN;LEE KI TAEK;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BAEK YONG HO;PARK SEOK HYUN;LEE KI TAEK |
分类号 |
H05K1/11;H01B5/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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