BOARD ASSEMBLIES, LIGHT EMITTING DEVICE ASSEMBLIES, AND METHODS OF MAKING THE SAME

摘要

Board assemblies, light emitting device assemblies and related methods are provided. An assembly can include a board comprising a face surface, a rear surface opposite the face surface and side edges around a periphery of the board. The assembly can also include a heat sink for dissipating heat from the board. The assembly can also include a retainer configured to secure the board to the heat sink. One or more light-emitting diode packages can be secured to the board for creating a light-emitting device assembly.