发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base bottom side and a base top side; mounting an integrated circuit perpendicular to the base top side, the integrated circuit having a first conductor partially exposed at a first end facing and connected to the base top side; and forming an encapsulation over the integrated circuit.
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申请公布号 |
US2012119345(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US20100946841 |
申请日期 |
2010.11.15 |
申请人 |
CHO SUNGWON;CHOI DAESIK;PARK HYUNGSANG |
发明人 |
CHO SUNGWON;CHOI DAESIK;PARK HYUNGSANG |
分类号 |
H01L23/538;H01L21/50 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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