发明名称 |
METHODS FOR READING A FEATURE PATTERN FROM A PACKAGED DIE |
摘要 |
Methods for tracking the identity of die after singulation from a wafer. The product chips and die include a pattern of features formed in a metallization level of a back-end-of-line (BEOL) wiring structure. The features in the pattern contain information relating to the die, such as a unique identifier that includes a wafer identification used to fabricate the die and a product chip location for the die on a wafer. The features may be imaged with the assistance of a beam of electromagnetic radiation that penetrates into a packaged die and is altered by the presence of the features in a way that promotes imaging.
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申请公布号 |
US2012120758(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201213359818 |
申请日期 |
2012.01.27 |
申请人 |
COHN JOHN M.;FLEMMING MARK J.;MALINOWSKI JOHN C.;SWANKE KARL V.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COHN JOHN M.;FLEMMING MARK J.;MALINOWSKI JOHN C.;SWANKE KARL V. |
分类号 |
G03B42/06;G01S15/88 |
主分类号 |
G03B42/06 |
代理机构 |
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代理人 |
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地址 |
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