发明名称 RESIN AND PHOTORESIST COMPOSITION
摘要 PURPOSE: A resin and a photoresist composite are provided to prevent pattern collapse of the photoresist pattern while manufacture line and space pattern of finer micron line width. CONSTITUTION: A resin has a structure which is represented by chemical formula aa. In the chemical formula, T^1 indicates substituted or non-substituted C4-34 sulton cyclic group, and X^1 is either -O- or - N (R^c)-. Here, R^c is either hydrogen or C1-6 alkyl group, Z^1 indicates *-X^2 or *-X^2-X^4-CO-X^3-. X^2 and X^3 are respectively C1-6 alkanediyl group. X^4 is -O- or -N(R^c)-, and *indicates combining portion with X. R^1 indicates alkyl group substituted or non-substituted with halogen, hydrogen, or halogen. The photoresist composite contains the resin and an acid generator.
申请公布号 KR20120049812(A) 申请公布日期 2012.05.17
申请号 KR20110114555 申请日期 2011.11.04
申请人 SUMITOMO CHEMICAL CO., LTD. 发明人 ICHIKAWA KOJI;SHIMADA MASAHIKO;NISHIMURA TAKASHI
分类号 C08F16/36;C08L29/12;G03F7/004;G03F7/26 主分类号 C08F16/36
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