发明名称 METHOD OF MANUFACTURING FLEXIBLE WIRING BOARD FOR TAPE CARRIER PACKAGE, AND RESIN COMPOSITION FOR CURABLE INSULATING FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible wiring board for tape carrier package including a step for inspecting by an optical automatic inspection device in which a flexible wiring board for tape carrier package can be manufactured economically with high productivity because possibility of producing harmful substance is low, and poor inspection rate can be reduced by minimizing drop in the inspection efficiency due to false detection. <P>SOLUTION: In the method of manufacturing a flexible wiring board for tape carrier package, the resin composition for a curable insulating film is colored while containing a pigment (A) which contains at least an extender (a1) not containing chlorine atom and bromine atom, and a pigment (a2) not containing chlorine atom and bromine atom. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012094850(A) 申请公布日期 2012.05.17
申请号 JP20110213904 申请日期 2011.09.29
申请人 UBE IND LTD 发明人 TAKAZAWA RYOICHI;KOHAMA YUKINORI;NAKAGAWA YOSHIHARU
分类号 H01L21/60 主分类号 H01L21/60
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