| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a circuit board having a high accuracy circuit pattern formed on a substrate by plating without causing occurrence of burrs at the time of cutting or generation of dust from the cut surface, and without restrictions of shape. <P>SOLUTION: The method of manufacturing a circuit board includes a step for preparing an individual piece insulating substrate at least the surface of which exhibits insulation properties, a step for forming an underlying layer on the surface of the insulating substrate, a contour formation step for forming a contour by selectively removing the boundary region of a non-circuit part becoming the insulating part of a circuit part to leave the circuit part and the pad region for power supply out of the underlying layer, a plating step for forming a plating layer by plating the underlying layer of the pad region as a power supply part, and a step for selectively removing the underlying layer exposed to the surface. An end face of the circuit part and the pad region for power supply is formed while spaced apart by a predetermined distance from the end face of the insulating substrate, and the surface of the underlying layer is entirely covered with the plating layer in the circuit part and the pad region for power supply. <P>COPYRIGHT: (C)2012,JPO&INPIT |
