发明名称 |
SEMICONDUCTOR APPARATUS AND FABRICATING METHOD THEREOF |
摘要 |
A semiconductor apparatus includes a semiconductor chip formed on a predetermined area of a wafer, wafer test block formed on an area outside the predetermined area, and signal line for electrically connecting the semiconductor chip to the wafer test block. Through-silicon via is formed to vertically penetrate the signal line.
|
申请公布号 |
US2012119208(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201113181802 |
申请日期 |
2011.07.13 |
申请人 |
SHIN SANG HOON;HYNIX SEMICONDUCTOR INC. |
发明人 |
SHIN SANG HOON |
分类号 |
H01L23/544;H01L21/28;H01L23/48 |
主分类号 |
H01L23/544 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|