| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-chip module (MCM) having a plurality of ground planes/layers. <P>SOLUTION: An integrated circuit (IC) chip of MAM has respectively its own ground plane on a substrate in the MCM. This MCM structure smoothly performs a separate test for each IC without affecting other chips or being affected by other chips. Further, This MCM structure facilitates a test of mutual interconnection and interconnection between two or more chips. <P>COPYRIGHT: (C)2012,JPO&INPIT |
