发明名称 Systems and Processes for Applying Shrink Labels
摘要 A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a pressure sensitive heat shrink label, to apply the label onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. Also described are high volume label application processes using assemblies of multiple label processors. Additional assemblies and methods are described for selectively contacting and adhering regions of a label onto a moving container during labeling operations. Select regions of a label can be wiped to modify or alter label portions that are in contact and not in contact with the container. A label treatment process performed after label application is also disclosed. The treatment process reduces the occurrence of label defects and improves label retention, adherence and aesthetics. The treatment process includes heating an applied label and adhesive to a particular temperature. In particular, the heating is performed immediately after label application.
申请公布号 US2012118503(A1) 申请公布日期 2012.05.17
申请号 US201013384649 申请日期 2010.07.27
申请人 LORENCE JAMES P.;BOCKMULLER JEREMY;CEVERA RICHARD L.;CHARNY JOHN A.;MCCLELLEN NICK;POTTER CRAIG W.;PREVITY RICHARD A.;ROSS SHAWN;SHELDON RICHARD W.;AVERY DENNISON CORPORATION 发明人 LORENCE JAMES P.;BOCKMULLER JEREMY;CEVERA RICHARD L.;CHARNY JOHN A.;MCCLELLEN NICK;POTTER CRAIG W.;PREVITY RICHARD A.;ROSS SHAWN;SHELDON RICHARD W.
分类号 B32B37/10;B32B37/06;B32B37/12;B65C9/24;B65C9/36 主分类号 B32B37/10
代理机构 代理人
主权项
地址