| 摘要 |
An LED package structure includes an insulation substrate, a heat-sink slug, an LED chip assembly, four diodes, and a lead-frame assembly. The heat-sink slug is inserted on the insulation substrate, and includes a loading surface exposed externally, where the LED chip assembly is fixed on the loading surface. The lead-frame assembly includes two externally-extended lead frames and four loading lead frames which are apart from one another, and which are all inserted on the insulation substrate. The four diodes are correspondingly loaded on, and electrically connected with, the four loading lead frames. The LED chip assembly and the four diodes constitute a bridge circuit, wherein the bridge circuit has its positive electrode and negative electrode located at the two externally-extended lead frames, respectively. Therefore, there is no need for the LED package structure to connect externally a rectifier diode module so as to achieve the purpose of convenient use. |
