| 摘要 |
PURPOSE: A resin composition for a lead lock tape is provided to prevent the shift of a lead, to enhance crosslinking density of a lead lock tape adhesive component, and to ensure excellent thermal resistance and physical strength. CONSTITUTION: A resin composition for a lead lock tape which is subsequently curable at high temperature comprises 100 parts by weight of an epoxy resin, 1~50 parts by weight of a low temperature hardening material, 10~80 parts by weight of a high temperature hardening material, and 20~150 parts by weight of a thermoplastic resin for modification. The low temperature hardening material is primary amine. The high temperature hardening material is a phenol-based hardening agent or anhydride-based hardening agent.
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