| 发明名称 |
THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT |
| 摘要 |
Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit. |
| 申请公布号 |
US2012122395(A1) |
申请公布日期 |
2012.05.17 |
| 申请号 |
US20100946072 |
申请日期 |
2010.11.15 |
| 申请人 |
YEH TZU-JIN;HSIEH HSIEH-HUNG;JIN JUN-DE;TSAI MING HSIEN;JOU CHEWN-PU;HSUEH FU-LUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YEH TZU-JIN;HSIEH HSIEH-HUNG;JIN JUN-DE;TSAI MING HSIEN;JOU CHEWN-PU;HSUEH FU-LUNG |
| 分类号 |
H04B5/00 |
主分类号 |
H04B5/00 |
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