发明名称 |
ELECTROLESS GOLD PLATING SOLUTION FOR FORMING FINE GOLD STRUCTURE, METHOD OF FORMING FINE GOLD STRUCTURE USING SAME, AND FINE GOLD STRUCTURE FORMED USING SAME |
摘要 |
An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100μm or smaller, in terms of the width of the exposed substrate area, and having a height of 3μm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100μm or finer is formed therefrom.
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申请公布号 |
US2012119352(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201013255392 |
申请日期 |
2010.03.10 |
申请人 |
IWAI RYOTA;TOKUHISA TOMOAKI;KATO MASARU;YOKOSHIMA TOKIHIRO;AOYAGI MASAHIRO;YAMAJI YASUHIRO;KIKUCHI KATSUYA;NAKAGAWA HIROSHI;KANTO KAGAKU KABUSHIKI KAISHA |
发明人 |
IWAI RYOTA;TOKUHISA TOMOAKI;KATO MASARU;YOKOSHIMA TOKIHIRO;AOYAGI MASAHIRO;YAMAJI YASUHIRO;KIKUCHI KATSUYA;NAKAGAWA HIROSHI |
分类号 |
H01L23/48;C09D1/00;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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