发明名称 |
GLASS THICK FILM EMBEDDED PASSIVE MATERIAL |
摘要 |
A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate. |
申请公布号 |
US2012118623(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201213359105 |
申请日期 |
2012.01.26 |
申请人 |
LOWER NATHAN P.;WILCOXON ROSS K.;BOONE ALAN P.;WYCKOFF NATHANIEL P.;HAMILTON BRANDON C.;ROCKWELL COLLINS, INC. |
发明人 |
LOWER NATHAN P.;WILCOXON ROSS K.;BOONE ALAN P.;WYCKOFF NATHANIEL P.;HAMILTON BRANDON C. |
分类号 |
H05K1/16;B05C5/00;B32B9/04;B82Y25/00;B82Y30/00;H01B1/14;H01F1/00 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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