SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which supply a process liquid to an entire main surface of a substrate while reducing the consumption of the process liquid.

SOLUTION: A substrate processing apparatus includes a spin chuck horizontally holding a substrate W without contacting with an upper surface and a lower surface of the substrate W, a process liquid supply mechanism supplying the process liquid to the upper surface and the lower surface of the substrate W held by the spin chuck, and an annular member 4 enclosing the substrate W held by the spin chuck. The annular member 4 includes an upper annular hydrophilic surface 29 enclosing an upper surface peripheral part of the substrate W and a lower annular hydrophilic surface 30 enclosing a lower surface peripheral part of the substrate W.

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